In a recent press release, Kazuto Yamaki, SIGMA’s CEO, provided updates on the development of their full-frame three-layer Foveon sensor. Despite the technical difficulties and multiple delays, the company is still working hard to bring this technology to life. The development of SIGMA’s full-frame Foveon sensor was first announced at Photokina 2018, and the product was expected to reach the shelves in 2020. However, a series of challenges arose along the way. These technical difficulties pushed the company back to the drawing board in February 2020 and caused many other delays. Long story short, this innovative full-frame sensor hasn’t seen the light yet (literally). However, in a recent press release, the company declared that the project isn’t over. SIGMA three-layer sensor design. Source: SIGMA SIGMA Full-Frame Three-Layer Sensor: the Foveon Technology Before we get to its development status, let’s take a look at how the Foveon technology differs from current imaging sensors and what improvements it might offer. Traditional Bayer-pattern digital sensors only contain a single layer of photosites. A red, green or blue filter sits on top of each pixel, letting only specific wavelengths of light pass through. As a result, each pixel only contains information about one of the three primary RGB color components (Red, Green or Blue). The two missing color channels are then reconstructed by interpolating data from adjacent pixels, in a process called demosaicing. A Bayer-pattern image sensor. Source: Wikipedia On the other hand, the design of the Foveon sensor is inspired by that of...
Published By: CineD - Friday, 25 February, 2022