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Big disappointment
  • Despite having received orders for tablet heat pipes, Taiwan-based cooling module makers are still not able to land orders from most smartphone vendors and are unlikely to do so until 2015, when demand for 4G LTE smartphones is expected to start picking up, according to sources from the cooling module makers.

    The sources pointed out that their orders for tablets are expected to rise significantly in 2014 with most orders to start shipping in the second or third quarters.

    However, cooling module makers are more interested in orders from smartphone vendors since smartphone shipments usually achieve over 30% on-year growth every year and are expected to rise by around the same percentage on year in 2014, the sources noted citing figures from research firms.

    http://www.digitimes.com/news/a20140317PD207.html

    Pity. I always liked my smartphone to be able to make me fresh omelette.

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  • Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness of their existing 0.6mm heat pipes for smart mobile devices by 25% and the new heat pipe is expected to enjoy a penetration rate of over 15% in the smart mobile device market with orders from tablets and smartphones.

    Sounds dangerous.

    http://www.digitimes.com/news/a20140421PD214.html